Mobile Signel Bosster

🧩 Functional SpecS

• Automatic Gain Control (AGC): Prevents overload in strong-signal areas.
• Echo / Feedback Cancellation: To avoid self-oscillation between donor and service antennas.
• Duplexing: Chips often support full-duplex (uplink + downlink simultaneously).
• Filtering: Band-selective filters to prevent interference with adjacent bands.
• 🔧 Physical & Integration SpecS

• Chip Type: LNA, PA, RF transceiver, or integrated RF SoC.
• Package: QFN / BGA packages (2×2 mm up to 8×8 mm).
• Operating Temperature: –40°C to +85°C (industrial grade).